Customizable 1A1 surface-grinding Vitrified diamond wheels designed for grinding diamond composite wafers CBN PCD insert and semiconductor silicon wafers.
Customizable 1A1 surface-grinding Vitrified diamond wheels designed for grinding diamond composite wafers CBN PCD insert and semiconductor silicon wafers.
Customizable 1A1 surface-grinding Vitrified diamond wheels designed for grinding diamond composite wafers CBN PCD insert and semiconductor silicon wafers.
Customizable 1A1 surface-grinding Vitrified diamond wheels designed for grinding diamond composite wafers CBN PCD insert and semiconductor silicon wafers.
Customizable 1A1 surface-grinding Vitrified diamond wheels designed for grinding diamond composite wafers CBN PCD insert and semiconductor silicon wafers.
Customizable 1A1 surface-grinding Vitrified diamond wheels designed for grinding diamond composite wafers CBN PCD insert and semiconductor silicon wafers.
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  • Customizable 1A1 surface-grinding Vitrified diamond wheels designed for grinding diamond composite wafers CBN PCD insert and semiconductor silicon wafers.
  • Customizable 1A1 surface-grinding Vitrified diamond wheels designed for grinding diamond composite wafers CBN PCD insert and semiconductor silicon wafers.
  • Customizable 1A1 surface-grinding Vitrified diamond wheels designed for grinding diamond composite wafers CBN PCD insert and semiconductor silicon wafers.
  • Customizable 1A1 surface-grinding Vitrified diamond wheels designed for grinding diamond composite wafers CBN PCD insert and semiconductor silicon wafers.
  • Customizable 1A1 surface-grinding Vitrified diamond wheels designed for grinding diamond composite wafers CBN PCD insert and semiconductor silicon wafers.
  • Customizable 1A1 surface-grinding Vitrified diamond wheels designed for grinding diamond composite wafers CBN PCD insert and semiconductor silicon wafers.

Customizable 1A1 surface-grinding Vitrified diamond wheels designed for grinding diamond composite wafers CBN PCD insert and semiconductor silicon wafers.

Product Category:

This customizable 1A1 vitrified diamond grinding wheel is engineered for precision surface grinding of ultra-hard tooling materials. It offers tailored abrasive specifications to efficiently and accurately grind polycrystalline diamond (PCD) inserts, cubic boron nitride (CBN) tooling, and cemented carbide components, delivering the sharp cutting edges and fine surface finishes required for high-performance cutting tools.
  • Product Description
    • Commodity name: Customizable 1A1 surface-grinding Vitrified diamond wheels designed for grinding diamond composite wafers CBN PCD insert and semiconductor silicon wafers.

    This customizable 1A1 vitrified diamond grinding wheel is engineered for precision surface grinding of ultra-hard tooling materials. It offers tailored abrasive specifications to efficiently and accurately grind polycrystalline diamond (PCD) inserts, cubic boron nitride (CBN) tooling, and cemented carbide components, delivering the sharp cutting edges and fine surface finishes required for high-performance cutting tools.

    Other attributes

    Grit

    150, 220, 80, 120, 100, 180, 400, 300, 600, 500, 1000, 800, 1500

    Brand name

    SAISU

    Model number

    Diamond grinding wheel

    Size

    Customized

    Product name

    Vitrified Bond Diamond Grinding Wheel

    Diamond bond

    Vitrified Bond

    Product descriptions from the supplier

    1. Application-Tailored Grit & Concentration – Diamond grain size and concentration can be customized to balance material removal rate and surface finish for your specific tool material (PCD, CBN, or Carbide), optimizing grinding efficiency and edge quality.

    2. Superior Thermal Management for Tool Integrity – The porous vitrified bond promotes cooler grinding by facilitating efficient coolant flow, which is critical to prevent thermal damage to the expensive PCD/CBN layers and cemented carbide substrates.

    3. Versatile Platform for Multi-Material Tool Shops – Serves as a single, high-performance wheel solution for shops grinding a mix of advanced tool materials, reducing inventory complexity while providing consistent, high-quality results across different production batches.

     

    Application
    Vitrified bond diamond grinding wheels are suitable for grinding PDC cutters, PCD and PCBN cutting tools, natural diamond cutting tools, various hard alloys, ceramics, glass, jewelry, molds, precision grinding applications, and metal ceramics.

    Product Information

     

    Size 100mm/110mm/125mm/150mm/200mm/250mm/350mm/400mm
    Rough Grinding W14 W28 W40
    Fine Grinding W10
    Finishing W5/W3.5
    Special specifications and specified grit size can be customized according to customer requirements.
Products Manual

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